Noble metal layer formation for copper film deposition

Details Noble metal layer formation for copper film deposition Noble metal layer formation for copper film deposition

2008-07-29

2008-07-29

Meeks, Timothy (Department: 1792)

Coating processes

Coating by vapor, gas, or smoke

C427S255230, C427S255700

Reexamination Certificate

active

07404985

ABSTRACT:
A method of noble metal layer formation for high aspect ratio interconnect features is described. The noble metal layer is formed using a cyclical deposition process. The cyclical deposition process comprises alternately adsorbing a noble metal-containing precursor and a reducing gas on a substrate structure. The adsorbed noble metal-containing precursor reacts with the adsorbed reducing gas to form the noble metal layer on the substrate. Suitable noble metals may include, for example, palladium (Pd), platinum (Pt) cobalt (Co), nickel (Ni) and rhodium (Rh).

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