Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-09-13
2005-09-13
Zarneke, David (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S612000, C438S613000, C438S614000, C438S615000, C438S616000, C438S660000, C438S127000, C438S124000, C438S126000, C257S787000, C257S789000, C257S795000
Reexamination Certificate
active
06943058
ABSTRACT:
A no-flow underfill material and process suitable for underfilling a bumped circuit component. The underfill material initially comprises a dielectric polymer material in which is dispersed a precursor capable of reacting to form an inorganic filler. The underfill process generally entails dispensing the underfill material over terminals on a substrate, and then placing the component on the substrate so that the underfill material is penetrated by the bumps on the component and the bumps contact the terminals on the substrate. The bumps are then reflowed to form solid electrical interconnects that are encapsulated by the resulting underfill layer. The precursor may be reacted to form the inorganic filler either during or after reflow.
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Chaudhuri Arun K.
Stepniak Frank
Walsh Matthew R.
Workman Derek B.
Chmielewski Stefan V.
Delphi Technologies Inc.
Yevsikov Victor V.
Zarneke David
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