No-flow underfill composition and method

Details No-flow underfill composition and method No-flow underfill composition and method

2006-01-03

2006-01-03

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S782000

Reexamination Certificate

active

06982492

ABSTRACT:
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.

REFERENCES:
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 6221691 (2001-04-01), Schrock
patent: 6806581 (2004-10-01), Hsieh
patent: 6844052 (2005-01-01), Jiang
patent: 6903463 (2005-06-01), Takeichi et al.

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