No fixture method to cure die attach for bonding IC dies to subs

Details No fixture method to cure die attach for bonding IC dies to subs No fixture method to cure die attach for bonding IC dies to subs

1994-05-31

1995-11-28

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174255, 174259, 361760, 361762, 361765, 361813, F05K 100

Patent

active

054710170

ABSTRACT:
A no fixture method to cure die attach for bonding IC dies (16) to substrates in which a solvent is applied to top and bottom surfaces of a thermoplastic die attach film (14), prior to component placement of the die (16) on a lead frame die support pad or on a printed circuit board PCB (12). The die attach film (14) is bonded to the IC die (16) and the lead frame, or to the IC die (16) and the printed circuit board PCB (12) upon drying of the solvent.

REFERENCES:
patent: 5371328 (1994-12-01), Gutierrez et al.

Affiliated with

Also associated with

Rating

No fixture method to cure die attach for bonding IC dies to subs does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with No fixture method to cure die attach for bonding IC dies to subs, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and No fixture method to cure die attach for bonding IC dies to subs will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2014968