Nitride semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Field effect transistor

Reexamination Certificate

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Details

C257S027000, C257S192000, C257S195000, C257SE29246, C257SE29247, C257SE29248, C257SE29249, C257SE29250, C257SE29251, C257SE29252

Reexamination Certificate

active

07825434

ABSTRACT:
A nitride semiconductor device includes: a first semiconductor layer made of first nitride semiconductor; a second semiconductor layer formed on a principal surface of the first semiconductor layer and made of second nitride semiconductor having a bandgap wider than that of the first nitride semiconductor; a control layer selectively formed on, or above, an upper portion of the second semiconductor layer and made of third nitride semiconductor having a p-type conductivity; source and drain electrodes formed on the second semiconductor layer at respective sides of the control layer; a gate electrode formed on the control layer; and a fourth semiconductor layer formed on a surface of the first semiconductor layer opposite to the principal surface, having a potential barrier in a valence band with respect to the first nitride semiconductor and made of fourth nitride semiconductor containing aluminum.

REFERENCES:
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patent: 2004/0238842 (2004-12-01), Micovic et al.
patent: 2006/0060871 (2006-03-01), Beach
patent: 2006/0121682 (2006-06-01), Saxler
patent: 2006/0273347 (2006-12-01), Hikita et al.
patent: 2009/0121775 (2009-05-01), Ueda et al.
patent: 11-261053 (1999-09-01), None
patent: 2004-273486 (2004-09-01), None
patent: 2004-273486 (2004-09-01), None
Norio Tsuyukuchi et al. “Low Leakage Current Enhancement Mode AIGaN/GaN Heterostructure Field Effect Transistor Using p-Type Gate Contact” Mar. 10, 2006. Japanese Journal of Applied Physics Vol. 45, No. 11.
Masahiro Hikita et al., “350V/150A AIGa/GaN power HFET on Silicon substrate with source-via grounding (SVG) structure,” Technical Digest of 2004 International Electron Devices Meeting, 2004 IEEE, p. 803.
O. Ambacher et al., “Two-dimensional electron gases induced by spontaneous and piezoelectric polarization charges in N- and Ga-face AIGaN/GaN heterostructures,” Journal of Applied Physics, Mar. 15, 1999, pp. 3222-3233, vol. 85, No. 6, 1999 American Institute of Physics.
L. Zhang et al., “Epitaxially-Grown GaN Junction Field Effect Transistors,” IEEE Transactions on Electron Devices, Mar. 2000, pp. 507-511, vol. 47, No. 3, 2000 IEEE.
Uemoto, et al., “A Normally-off AIGaN/GaN Transistor with RonA=2.6mΩcm2 and BVds=640V Using Conductivity Modulation,” IEEE 2006.

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