Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-01-15
2008-01-15
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21098
Reexamination Certificate
active
07319064
ABSTRACT:
A process for preparing a nitride based semiconductor device in accordance with the present invention comprises growing a high temperature AlN single crystal layer on a substrate; growing a first GaN layer on the high temperature AlN single crystal layer in a first V/III ratio, under a first pressure of 300 Torr or more, such that the predominant direction of growth is the lateral direction; and growing a second GaN layer on the first GaN layer in a second V/III ratio lower than the first V/III ratio, under a second pressure lower than the first pressure such that the predominant direction of growth is the lateral direction.
REFERENCES:
patent: 2006/0102926 (2006-05-01), Kikkawa et al.
Cho Hyun Ick
Lee Jae Hoon
Lee Jung Hee
Geyer Scott B.
McDermott Will & Emery LLP
Samsung Electro-Mechanics Co. Ltd.
Ullah Elias
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