Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1985-06-26
1987-11-17
Hearn, Brian E.
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
357 70, 2281802, 437220, C23F 100, H01L 2192
Patent
active
047074183
ABSTRACT:
An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.
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Abolafia, O. R., "Chip Interconnection Device", IBM Technical Disclosure Bulletin, vol. 15, No. 2, Jul. 1982, p. 420.
Hilton Robert E.
Shah Divyesh P.
Takiar Hem P.
Hearn Brian E.
National Semiconductor Corporation
Quach T. N.
Woodward Gail W.
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