Nickel bonding cap over copper metalized bondpads

Details Nickel bonding cap over copper metalized bondpads Nickel bonding cap over copper metalized bondpads

2006-08-17

2009-02-03

Booth, Richard A. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

07485565

ABSTRACT:
A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.

REFERENCES:
patent: 3599060 (1971-08-01), Triggs et al.
patent: 5869126 (1999-02-01), Kukanskis
patent: 6259161 (2001-07-01), Wu et al.
patent: 6281090 (2001-08-01), Kukanskis et al.
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6362089 (2002-03-01), Molla et al.
patent: 6593221 (2003-07-01), Lindgren
patent: 6897761 (2005-05-01), Ernsberger et al.
patent: 7186636 (2007-03-01), Gleason et al.

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