Nickel bonding cap over copper metalized bondpads

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S686000, C438S508000, C438S508000, C438S687000, C438S617000

Reexamination Certificate

active

10915757

ABSTRACT:
A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.

REFERENCES:
patent: 3599060 (1971-08-01), Triggs et al.
patent: 5869126 (1999-02-01), Kukanskis
patent: 6259161 (2001-07-01), Wu et al.
patent: 6281090 (2001-08-01), Kukanskis et al.
patent: 6335104 (2002-01-01), Sambucetti et al.
patent: 6362089 (2002-03-01), Molla et al.
patent: 6593221 (2003-07-01), Lindgren
patent: 6835643 (2004-12-01), Akram
patent: 6853076 (2005-02-01), Datta et al.
patent: 2004/0108937 (2004-06-01), Ernsberger et al.
Donald W. Baudrand, Use of Electroless Nickel To Reduce Gold Requirements, Plating and Surfacing Finishing, pp. 57-60, (Dec. 1981).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Nickel bonding cap over copper metalized bondpads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Nickel bonding cap over copper metalized bondpads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nickel bonding cap over copper metalized bondpads will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3773356

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.