Nickel bonding cap over copper metalized bondpads

Details Nickel bonding cap over copper metalized bondpads Nickel bonding cap over copper metalized bondpads

2007-03-06

2007-03-06

Lee, Eugene (Department: 2815)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S686000, C438S508000, C438S508000, C438S687000, C438S617000

Reexamination Certificate

active

10915757

ABSTRACT:
A method for forming a nickel cap layer over copper metalized bond pad is disclosed in which the phosphorous content of the nickel cap, and particularly the surface of the nickel cap, may be controlled. The phosphorous content of the surface of the nickel cap is suitably determined such that oxidation is inhibited. The resulting nickel cap may be wire-bonded directly, without the deposition of a gold cap layer.

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Donald W. Baudrand, Use of Electroless Nickel To Reduce Gold Requirements, Plating and Surfacing Finishing, pp. 57-60, (Dec. 1981).

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