Nextgen wet process tank

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

Reexamination Certificate

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Details

C134S902000, C134S113000, C134S186000, C134S200000, C134S010000, C134S002000, C134S034000

Reexamination Certificate

active

06840250

ABSTRACT:
A process tank for processing a plurality of wafers having a diameter, the process tank comprising: two substantially vertical side walls being a first distance apart; wherein the first distance is substantially equal to the diameter of the wafer; two upwardly angled walls positioned between the side walls; a first transducer array coupled to a first of the upwardly angled walls, the first transducer array extending a length less than the diameter of the wafer; and a second transducer array coupled to a second of the upwardly angled walls, the second transducer array extending a length less than the diameter of the wafer. It is preferred that the process tank further comprise a fluid inlet positioned between the upwardly angled walls. In another aspect, the invention is a method of processing wafers comprising: filling the process tank described above with a wafer processing liquid through the tank inlet; submerging a wafer carrier holding a plurality wafers into the tank; and applying megasonic energy to the liquid through the first and second transducer arrays for a predetermined time and in a predetermined pattern.

REFERENCES:
patent: 5776296 (1998-07-01), Matthews
patent: 5921257 (1999-07-01), Weber et al.
patent: 5996595 (1999-12-01), Olesen et al.
patent: 6021791 (2000-02-01), Dryer et al.
patent: 6148833 (2000-11-01), Tang et al.
patent: 6189552 (2001-02-01), Oshinowo
patent: 6607604 (2003-08-01), Oshinowo

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