Neutralizing chloride ions in via holes in multilayer printed ci

Details Neutralizing chloride ions in via holes in multilayer printed ci Neutralizing chloride ions in via holes in multilayer printed ci

1982-06-28

1983-08-16

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 2219, 134 27, 134 34, 156631, 156634, 156644, 156902, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

043989934

ABSTRACT:
A neutralization process is provided for neutralizing chloride ions in etched via holes in multilayer printed circuit boards. The process comprises two dip operations of the board in a Neutra-Clean and water solution which is continuously re-circulated. This is followed by subjecting the board to a heated de-ionized cascaded water feed, an ambient overflow de-ionized water rinse, and conveyorized air drying. The Neutra-Clean solution has the ability to penetrate down to the bottom of the via hole and to attract the free chloride ions from the etchant residue. The de-ionized water feed and rinse steps rinse out and remove the Neutra-Clean solution and any residuals formed by chemical reaction.

REFERENCES:
patent: 4155775 (1979-05-01), Alpaugh et al.

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