Neural network control of chemical mechanical planarization

Details Neural network control of chemical mechanical planarization Neural network control of chemical mechanical planarization

2006-02-21

2006-02-21

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S008000, C451S041000

Reexamination Certificate

active

07001243

ABSTRACT:
Broadly speaking, a method for controlling a chemical mechanical planarization (CMP) process to obtain a desired result is provided. More specifically, the method incorporates a first neural network to estimate a CMP result and a second neural network to tune CMP control parameters used to obtain the CMP result. The second neural network tunes the CMP control parameters to minimize a difference between the CMP result and a desired CMP result.

REFERENCES:
patent: 6594024 (2003-07-01), Singh et al.
patent: 6686270 (2004-02-01), Subramanian et al.
patent: 6813534 (2004-11-01), Sui et al.
patent: 2004/0076944 (2004-04-01), Chan et al.

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