Negative type deep ultraviolet resist

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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20415914, 20415922, 430286, 430288, 430302, 430306, 526323, G03C 168

Patent

active

042672589

ABSTRACT:
A negative type resist is provided for deep ultraviolet light lithography. This resist comprises a polymer of a diallyl ester of a dicarboxylic acid having a degree of dispersion of 3 or less, which is given by the ratio of a weight-average molecular weight Mw to a number-average molecular weight Mn. This deep UV resist can produce a fine detail resist pattern having a high resolution, and it has a high sensitivity to irradiating the coated film of the polymer on a substrate with deep UV light followed by development.

REFERENCES:
patent: 3087915 (1963-04-01), Heiberger et al.
patent: 3113123 (1963-12-01), Heiberger et al.
patent: 3475176 (1969-10-01), Rauner

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