Negative photosensitive resin composition

Details Negative photosensitive resin composition Negative photosensitive resin composition

2005-05-04

2009-02-24

Lee, Sin J. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S287100, C430S325000, C430S907000

Reexamination Certificate

active

07494764

ABSTRACT:
A negative photosensitive resin composition comprising an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule, an ink repellent (B) made of a polymer having polymerized units (b1) having a C20or lower alkyl group in which at least one of its hydrogen atoms is substituted by a fluorine atom (provided that the alkyl group may contain etheric oxygen), and polymerized units (b2) having an ethylenic double bond, and a photopolymerization initiator (C), wherein the fluorine content in the ink repellent (B) is from 5 to 25 mass %, and the proportion of the ink repellent (B) is from 0.01 to 20 mass %, based on the total solid content of the negative photosensitive resin composition. The negative photosensitive resin composition of the present invention is excellent in adhesion to a substrate, ink repellency and durability thereof and further excellent in alkali solubility and developability.

REFERENCES:
patent: 6007961 (1999-12-01), Inomata et al.
patent: 6071670 (2000-06-01), Ushirogouchi et al.
patent: 6228559 (2001-05-01), Oda
patent: 6514657 (2003-02-01), Sakurai et al.
patent: 6689539 (2004-02-01), Kamiya et al.
patent: 2005/0191580 (2005-09-01), Takahashi et al.
patent: 4-39317 (1992-02-01), None
patent: 8-176504 (1996-07-01), None
patent: 10-142779 (1998-05-01), None
patent: 11-281815 (1999-10-01), None
patent: 2001-253928 (2001-09-01), None
patent: 2002-6491 (2002-01-01), None
U.S. Appl. No. 12/127,993, filed May 28, 2008, Ishizeki et al.
U.S. Appl. No. 12/138,648, filed Jun. 31, 2008, Takahashi et al.

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