Negative photoresist compositions for the formation of thick...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S910000

Reexamination Certificate

active

07129018

ABSTRACT:
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 μm thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.

REFERENCES:
patent: 2754279 (1956-07-01), Hall et al.
patent: 3576659 (1971-04-01), Oliveri et al.
patent: 3634082 (1972-01-01), Christensen
patent: 4356288 (1982-10-01), Lewis et al.
patent: 4506006 (1985-03-01), Ruckert
patent: 4888379 (1989-12-01), Henning et al.
patent: 5057397 (1991-10-01), Miyabe et al.
patent: 5227276 (1993-07-01), Roeschert et al.
patent: 5227281 (1993-07-01), Gaschler et al.
patent: 5494777 (1996-02-01), Shiraki et al.
patent: 5858615 (1999-01-01), Hawkins
patent: 5942369 (1999-08-01), Ota et al.
patent: 5965319 (1999-10-01), Kobayashi
patent: 6451502 (2002-09-01), Ray et al.
patent: 6641972 (2003-11-01), Misumi et al.
patent: 6740470 (2004-05-01), Tan et al.
patent: 0 399 698 (1990-11-01), None
patent: 1 046 956 (2000-10-01), None
patent: 1157738 (1969-07-01), None
patent: 10274853 (1998-10-01), None
patent: 11-216965 (1999-08-01), None
patent: 2000-250210 (2000-09-01), None
patent: 2000-0076765 (2000-12-01), None
AN 1966:500694, CAPLUS, Entered in STN Apr. 22, 2001, ACS on STN, Abstract of FR 1434742 printed 1996, 1 pagen.
Frye et al, “Investigation of photoresist and the photoresist/wafer interface with a local thermal probe,” in Advances in Resist Technology and Processing XV, Will Conley, Editor, Proceedings of SPIE, vol. 333, pp. 1031-1039 (1998).
Cadogan et al, “Plasticizers; I. Introduction”, Ullmann's Encyclopedia of Industrial Chemistry, Wiley-VCH Verlag GmbH & Co, KGaA, Article online positing date: Jun. 15, 2000, 3 pages at www.mrw.interscience.wiley.com/ueic/articles/a20—439/sect1.

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