Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-01-31
2006-01-31
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S313000, C430S914000, C430S905000, C430S910000, C430S907000
Reexamination Certificate
active
06991890
ABSTRACT:
A negative photoresist composition and a method of patterning a substrate through use of the negative photoresist composition. The composition includes: a radiation sensitive acid generator; an additive; and a resist polymer derived from at least one first monomer including a hydroxy group. The first monomer may be acidic or approximately pH neutral. The resist polymer may be further derived from a second monomer having an aqueous base soluble moiety. The additive may include one or more alicyclic structures. The acid generator is adapted to generate an acid upon exposure to radiation. The resist polymer is adapted to chemically react with the additive in the presence of the acid to generate a non-crosslinking reaction product that is insoluble in an aqueous alkaline developer solution.
REFERENCES:
patent: 6749988 (2004-06-01), Hatakeyama et al.
patent: 2005/0058930 (2005-03-01), Li et al.
patent: 2000-66393 (2000-03-01), None
English abstract for JP 2000-66393 (Chemical Abstract).
Hamad Alyssandrea H.
Li Wenjie
Varanasi Pushkara R.
Capella Steve
Lee Sin
Schmeiser Olsen & Watts
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