Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1991-11-29
1992-07-07
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430925, 430919, 430923, 430905, 430945, 522 2, 522 67, 522 45, 522 59, 522 63, 522 53, 522150, 522 65, G03F 7038
Patent
active
051282313
ABSTRACT:
A photoresist composition is disclosed. The photoresist composition comprises a base resin, a photosensitizer, and a solvent. The base resin comprises polyhydroxystyrene represented by the following structural formula (I): ##STR1## (wherein k is a positive integer). The photosensitizer comprises a polyhalogen compound(s). The photoresist composition of the present invention has dry etching resistance characteristics comparable to those of conventional positive novolak photoresist compositions and can form a resist pattern with a high resolution and vertical sidewall profiles. This makes microprocessing possible.
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A. Bruns et al., Microelectronic Engineering 6(1987) 467-471.
Asano Takateru
Itoh Toshio
Kosuga Yuuzi
Sakata Miwa
Umehara Hiroshi
Fuji Chemicals Industrial Co. Ltd.
Hamilton Cynthia
OKI Electric Industry Co., Ltd.
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