Negative photoresist composition comprising a photosensitizer of

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430925, 430919, 430923, 430905, 430945, 522 2, 522 67, 522 45, 522 59, 522 63, 522 53, 522150, 522 65, G03F 7038

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active

051282313

ABSTRACT:
A photoresist composition is disclosed. The photoresist composition comprises a base resin, a photosensitizer, and a solvent. The base resin comprises polyhydroxystyrene represented by the following structural formula (I): ##STR1## (wherein k is a positive integer). The photosensitizer comprises a polyhalogen compound(s). The photoresist composition of the present invention has dry etching resistance characteristics comparable to those of conventional positive novolak photoresist compositions and can form a resist pattern with a high resolution and vertical sidewall profiles. This makes microprocessing possible.

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patent: 5034304 (1991-07-01), Feely
A. Bruns et al., Microelectronic Engineering 6(1987) 467-471.

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