Negative photoresist composition

Details Negative photoresist composition Negative photoresist composition

2008-05-20

2008-05-20

Hamilton, Cynthia (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S287100, C430S916000, C430S947000, C430S920000

Reexamination Certificate

active

11365489

ABSTRACT:
The present invention is directed to a negative photoresist composition which mainly is composed of a) a polyimide having pendant carboxyl groups, wherein a portion of the carboxyl groups reacted with glycidyl (meth)acrylate monomers to form covalent bonds. The photoresist composition further contains b) monomers having a tertiary amino group and a C═C double bond, which form ionic bonds with the remaining hydroxyl groups of the polyimide. The photoresist composition further contains c) a photoinitiator which is also called photosensitizer. The components a) to c) are all dissolved in a solvent.

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patent: 6090525 (2000-07-01), Yuba et al.
patent: 2002/0045127 (2002-04-01), Chiang et al.

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