Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-07-25
2006-07-25
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S311000, C430S313000, C430S329000, C430S905000, C430S906000, C430S907000, C430S910000, C430S914000, C430S921000, C430S922000
Reexamination Certificate
active
07081326
ABSTRACT:
A negative photoresist composition and a method of patterning a substrate through use of the negative photoresist composition. The composition includes: a radiation sensitive acid generator; a multihydroxy-containing additive; and a resist polymer comprising a first repeating unit from a first monomer. The resist polymer may also comprise a second repeating unit from a second monomer, wherein the second monomer has an aqueous base soluble moiety. The multihydroxy-containing additive has the structure Q-(OH)m, where Q may include at least one alicycic group and m may be any integer between 2 and 6. The acid generator is adapted to generate an acid upon exposure to radiation. The resist polymer is adapted to chemically react with the additive in the presence of the acid to generate a product that is insoluble in a developer solution.
REFERENCES:
patent: 6074801 (2000-06-01), Iwasa et al.
patent: 2000-63433 (2000-02-01), None
Chemical Abstract (132:187644) for JP 2000-63433 (Iwasa et al).
Machine-assisted English translation for JP 2000-63433 (Iwasa et al) provided by JPO.
Full, formal English translation of JP 2000-63433 (Iwasa et al), provided by USPTO.
Li Wenjie
Varanasi Pushkara R.
Capella Steven
Lee Sin
Schmeiser Olsen & Watts
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