Near chip size integrated circuit package

Details Near chip size integrated circuit package Near chip size integrated circuit package

1996-10-31

1999-11-09

Chaudhuri, Olik

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

438112, 438123, 438124, 438126, 438613, H01L 2156, H01L 2144

Patent

active

059813148

ABSTRACT:
A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on the IC chip are electrically connected to first metallizations on a substrate first surface. The first metallizations, IC chip including bonding pads and first substrate surface are then encapsulated. Interconnection balls or pads are formed at substrate bonding locations on a substrate second surface, the interconnection pads or balls being electrically connected to corresponding first metallizations. The substrate and encapsulant are then cut along the periphery of each section to form the plurality of IC chip packages.

REFERENCES:
patent: 4508758 (1985-04-01), Wong
patent: 4530152 (1985-07-01), Roche et al.
patent: 4890383 (1990-01-01), Lumbard et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5126818 (1992-06-01), Takami et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5227663 (1993-07-01), Patil et al.
patent: 5239198 (1993-08-01), Lin et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5250470 (1993-10-01), Yamaguchi
patent: 5258650 (1993-11-01), Polak et al.
patent: 5311060 (1994-05-01), Rostoker et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5386342 (1995-01-01), Rostoker
patent: 5397746 (1995-03-01), Blish, III
patent: 5436203 (1995-07-01), Lin
patent: 5468999 (1995-11-01), Lin et al.
patent: 5473512 (1995-12-01), Degani et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5489059 (1996-02-01), Rostoker et al.
patent: 5578525 (1996-11-01), Mizukoshi
patent: 5593926 (1997-01-01), Fujihara
patent: 5596485 (1997-01-01), Glenn et al.
patent: 5612513 (1997-03-01), Tuttle et al.
patent: 5639989 (1997-06-01), Higgins, III
patent: 5700981 (1997-12-01), Tuttle et al.
patent: 5719440 (1998-02-01), Moden
patent: 5767447 (1998-06-01), Dudderar et al.
patent: 5776798 (1998-07-01), Quan et al.
Banerji, K., "Development of the Slightly Larger Than IC Carrier (SLICC)", Proceedings of the Feb. 27-Mar. 4, 1994, Technical Program NEPCON WEST '94, pp. 1249-1256.
Levine, B. and Guinther, F., "The Package", Electronic News vol. 42, No. 2112 (1996), pp. 1, 32.

Affiliated with

Also associated with

Rating

Near chip size integrated circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Near chip size integrated circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Near chip size integrated circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1454910