Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2011-04-19
2011-04-19
Hartman, Jr., Ronald D (Department: 2121)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S032000, C700S033000, C700S044000, C700S045000, C700S108000, C700S109000, C700S110000, C700S117000, C700S118000, C700S119000, C700S120000, C700S121000, C451S001000, C451S005000, C451S008000, C451S009000, C451S011000, C451S262000, C451S264000, C451S265000, C451S269000
Reexamination Certificate
active
07930058
ABSTRACT:
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
REFERENCES:
patent: 2448751 (1948-09-01), Volkel
patent: 5347761 (1994-09-01), Murai
patent: 5402354 (1995-03-01), Okino et al.
patent: 5473532 (1995-12-01), Unno et al.
patent: 5625561 (1997-04-01), Kato et al.
patent: 5815400 (1998-09-01), Hirai et al.
patent: 5816895 (1998-10-01), Honda
patent: 5942445 (1999-08-01), Kato et al.
patent: 5989108 (1999-11-01), Ikeda et al.
patent: 6165054 (2000-12-01), Abe et al.
patent: 6198294 (2001-03-01), Black
patent: 6298279 (2001-10-01), Shimada et al.
patent: 6368881 (2002-04-01), Brouillette et al.
patent: 6428388 (2002-08-01), Molnar
patent: 6479386 (2002-11-01), Ng et al.
patent: 6556876 (2003-04-01), Prosack et al.
patent: 6556884 (2003-04-01), Miller et al.
patent: 6594024 (2003-07-01), Singh et al.
patent: 6613591 (2003-09-01), Bhagavat et al.
patent: 6630360 (2003-10-01), Christian et al.
patent: 6635500 (2003-10-01), Lewis
patent: 6652358 (2003-11-01), Ikeda et al.
patent: 6726525 (2004-04-01), Kato et al.
patent: 6739944 (2004-05-01), Sandhu et al.
patent: 6852012 (2005-02-01), Vepa et al.
patent: 6997779 (2006-02-01), Junge et al.
patent: 7070477 (2006-07-01), Morisawa et al.
patent: 7150674 (2006-12-01), Okura
patent: 7174520 (2007-02-01), White et al.
patent: 7483818 (2009-01-01), Amakai et al.
patent: 7601049 (2009-10-01), Bhagavat et al.
patent: 7822500 (2010-10-01), Kobayashi et al.
patent: 2002/0086625 (2002-07-01), Vepa et al.
patent: 2002/0102920 (2002-08-01), Vogtmann et al.
patent: 2002/0185053 (2002-12-01), Fei et al.
patent: 2003/0017787 (2003-01-01), Weldon et al.
patent: 2003/0055612 (2003-03-01), Amakai et al.
patent: 2003/0060050 (2003-03-01), Pietsch et al.
patent: 2003/0186546 (2003-10-01), Wollstein et al.
patent: 2004/0043616 (2004-03-01), Harrison et al.
patent: 2005/0173377 (2005-08-01), Pietsch et al.
patent: 2005/0202757 (2005-09-01), Junge et al.
patent: 2006/0009125 (2006-01-01), Okura
patent: 2006/0110837 (2006-05-01), Gupta et al.
patent: 2007/0006652 (2007-01-01), Weldon, Jr. et al.
patent: 2007/0100489 (2007-05-01), Huandra
patent: 2007/0243795 (2007-10-01), Kobayashi et al.
patent: 2008/0166823 (2008-07-01), Okabe et al.
patent: 2008/0233840 (2008-09-01), Pietsch et al.
patent: 1667799 (2005-09-01), None
patent: 102004011996 (2005-09-01), None
patent: 0755751 (1997-01-01), None
patent: 1118429 (2001-07-01), None
patent: 1457828 (2004-09-01), None
patent: 2000280155 (2000-10-01), None
patent: 2002307303 (2002-10-01), None
patent: 0211947 (2002-02-01), None
patent: 2005095054 (2005-10-01), None
patent: 2007130708 (2007-11-01), None
Wafer Grinding and Lapping Compared; 3 pages; printed from Internet (http://logitech.uk.com/lapping.asp) on Nov. 20, 2010.
PCT International Search Report and Written Opinion of the International Searching Authority mailed on Apr. 27, 2009 regarding PCT/US2008/088452 filed on Dec. 29, 2008, 15 pgs.
“Defect BitCell, Test, Data Transfer and Storage Software”, Zenpire, http://www.zenpire.conn/products/iFabDefect01.html, accessed Dec. 10, 2005, 4 pages.
“Grinding Machines for Semiconductor Wafers”, Crystec Technology Trading GmbH, http://www.crystec.com/ kmisemie.htm, accessed Oct. 12, 2005, 4 pages.
“Intelligent Defect Analysis of Software”, SiGlaz, http://www.siglaz.com, accessed Dec. 10, 2005, 7 pages.
“STDF Examinator Ideal for semiconductor Defect Analysis!”, Galaxy, http://www.galaxysemi.com/examinator/description/search/examinator—defect.htm, accessed Dec. 10, 2005, 5 pages.
“Using SSA to measure the efficacy of automated defect data gathering”, Micro Magazine, http://www.micromagazine.com/archive/98/04/tobin.html, accessed Dec. 10, 2005, 10 pages.
“Defect Signature Analyzer”, SiGlaz, SiGlaz, http://www.siglaz.com, accessed Dec. 10, 2005, 2 pages.
“Automotion Workbench”, SiGlaz, http://www.siglaz.com, accessed Dec. 10, 2005, 2 pages.
“Real-Time Process Monitor”, SiGlaz, http://www.siglaz.com, accessed Dec. 10, 2005, 2 pages.
“Intelligent Reporting System”, SiGlaz, http://www.siglaz.com, accessed Dec. 10, 2005, 2 pages.
International Search Report for application No. PCT/US2007/060981.
Singapore Search Report and Written Opinion mailed on Aug. 19, 2010 regarding Singapore Patent Application No. 200805494-2 filed on Jan. 24, 2007; 10 pages.
Bhagavat Sumeet S.
Kaneko Tomohiko
Kazama Takuto
Komura Tomomi
Vandamme Roland R.
Armstrong Teasdale LLP
Hartman Jr. Ronald D
MEMC Electronic Materials , Inc.
LandOfFree
Nanotopography control and optimization using feedback from... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Nanotopography control and optimization using feedback from..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Nanotopography control and optimization using feedback from... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2691022