Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1998-08-27
2000-03-14
Bowers, Charles
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438781, 438782, 438790, 427245, 427246, H01L 21316
Patent
active
060372753
ABSTRACT:
A process for forming a nanoporous dielectric coating on a substrate. The process includes either (i) combining a stream of an alkoxysilane composition with a stream of a base containing catalyst composition to form a combined composition stream; immediately depositing the combined composition stream onto a surface of a substrate and exposing the combined composition to water (in either order or simultaneously); and curing the combined composition; or (ii) combining a stream of an alkoxysilane composition with a stream of water to form a combined composition stream; immediately depositing the combined composition stream onto a surface of a substrate; and curing the combined composition.
REFERENCES:
patent: 4510176 (1985-04-01), Cuthbert
patent: 5001084 (1991-03-01), Kawai
patent: 5094884 (1992-03-01), Hillman
patent: 5315724 (1994-05-01), Tsukune
patent: 5646071 (1997-07-01), Lin
patent: 5658615 (1997-08-01), Hasebe
patent: 5753305 (1998-05-01), Smith
patent: 5817582 (1998-10-01), Maniar
Brungardt Lisa Beth
Drage James S.
Ramos Teresa
Smith Douglas M.
Wu Hui-Jung
Allied-Signal Inc.
Bowers Charles
Weise Leslie A.
Whipple Matthew
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