Nanometer-scale ablation using focused, coherent extreme...

Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing

Reexamination Certificate

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C425S174400

Reexamination Certificate

active

07931850

ABSTRACT:
Ablation of holes having diameters as small as 82 nm and having clean walls was obtained in a poly(methyl methacrylate) on a silicon substrate by focusing pulses from a Ne-like Ar, 46.9 nm wavelength, capillary-discharge laser using a freestanding Fresnel zone plate diffracting into third order is described. Spectroscopic analysis of light from the ablation has also been performed. These results demonstrate the use of focused coherent EUV/SXR light for the direct nanoscale patterning of materials.

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