Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2007-12-04
2007-12-04
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S135000, C205S170000, C205S181000, C205S182000, C205S221000, C205S222000, C205S223000, C205S229000
Reexamination Certificate
active
10434497
ABSTRACT:
Multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching Operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching Operations may be separated by intermediate post processing activities, they may be separated by cleaning Operations, or barrier material removal Operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
REFERENCES:
patent: 5190637 (1993-03-01), Guckel
patent: 6027630 (2000-02-01), Cohen
Cohen et al., “EFAB: Rapid, low-cost desktop micromachining of high aspect ratio true 3-D MEMS,” 12th IEEE International Conference on Microelectromechanical Systems, p. 244-251 (Jan. 17-21, 1999).
Cohen Adam L.
Lockard Michael S.
McPherson Dale S.
Microfabrica Inc.
Smalley Dennis R.
Wong Edna
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