Multiprobe detection system for chemical-mechanical...

Details Multiprobe detection system for chemical-mechanical... Multiprobe detection system for chemical-mechanical...

2005-11-01

2005-11-01

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S041000

Reexamination Certificate

active

06960115

ABSTRACT:
The invention is a method and apparatus for planarizing a wafer. Discrete measurements are taken across the surface of the wafer at a desired spatial density. The measurements may be generated using a flash lamp to reflect a light signal off the surface of the wafer with a spectrometer analyzing the reflected light. A plurality of probes may be used at different locations to shorten the time necessary for taking measurements across the full front surface of the wafer and for allowing a plurality of areas to be sampled substantially simultaneously. A control system receives the measurements and their corresponding locations. The control system is then able to analyze the data looking for areas or bands on the front surface of the wafer that need an increase or decrease in material removal rate. The control system is then able to adjust one or more planarization parameters to improve the process for the current wafer or for future wafers.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5461007 (1995-10-01), Kobayashi
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5700180 (1997-12-01), Sandhu et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 6106662 (2000-08-01), Bibby et al.

Affiliated with

Also associated with

Rating

Multiprobe detection system for chemical-mechanical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiprobe detection system for chemical-mechanical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiprobe detection system for chemical-mechanical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3513905