Multiple wire adhesive on a multiple wire wiring board

Details Multiple wire adhesive on a multiple wire wiring board Multiple wire adhesive on a multiple wire wiring board

1994-11-21

1996-01-23

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174251, 174262, 361792, H05K 102

Patent

active

054866553

ABSTRACT:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.

REFERENCES:
patent: 3646572 (1972-02-01), Burr
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 4097684 (1978-07-01), Burr
patent: 4450623 (1984-05-01), Burr
patent: 4544801 (1985-10-01), Rudik et al.
patent: 4646436 (1987-03-01), Crowell et al.

Affiliated with

Also associated with

Rating

Multiple wire adhesive on a multiple wire wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple wire adhesive on a multiple wire wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple wire adhesive on a multiple wire wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1506094