Electrical computers and digital data processing systems: input/ – Intrasystem connection – Bus interface architecture
Reexamination Certificate
2005-12-27
2005-12-27
Auve, Glenn A. (Department: 2111)
Electrical computers and digital data processing systems: input/
Intrasystem connection
Bus interface architecture
C710S316000, C326S038000, C326S041000, C257S666000, C257S676000, C257SE23010, C257SE23030, C257SE23070
Reexamination Certificate
active
06981090
ABSTRACT:
A circuit arrangement permits a microcontroller wirebond pad to be configured to be an analog or digital input or output. The circuit arrangement uses any of a plurality of switching configurations to selectively determine the use of the wirebond pad under control of the microcontroller's processor. The microcontroller can be configured using configurable analog and configurable digital blocks to perform any of a plurality of functions with certain of the pinouts determined under program control.
REFERENCES:
patent: 5107146 (1992-04-01), El-Ayat
patent: 5161124 (1992-11-01), Love
patent: 5202687 (1993-04-01), Distinti
patent: 5305312 (1994-04-01), Fornek et al.
patent: 5414380 (1995-05-01), Floyd et al.
patent: 5555452 (1996-09-01), Callaway et al.
patent: 5563526 (1996-10-01), Hastings et al.
patent: 5563529 (1996-10-01), Seltzer et al.
patent: 5677691 (1997-10-01), Hosticka et al.
patent: 5680070 (1997-10-01), Anderson et al.
patent: 5686844 (1997-11-01), Hull et al.
patent: 5724009 (1998-03-01), Collins et al.
patent: 5727170 (1998-03-01), Mitchell et al.
patent: 5734334 (1998-03-01), Hsieh et al.
patent: 5790957 (1998-08-01), Heidari
patent: 5869979 (1999-02-01), Bocchino
patent: 6057705 (2000-05-01), Wojewoda et al.
patent: 6112264 (2000-08-01), Beasley et al.
patent: 6144327 (2000-11-01), Distinti et al.
patent: 6167559 (2000-12-01), Furtek et al.
patent: 6188241 (2001-02-01), Gauthier et al.
patent: 6192431 (2001-02-01), Dabral et al.
patent: RE37195 (2001-05-01), Kean
patent: 6246258 (2001-06-01), Lesea
patent: 6337579 (2002-01-01), Mochida
patent: 6355980 (2002-03-01), Callahan
patent: 6356958 (2002-03-01), Lin
patent: 6492834 (2002-12-01), Lytle et al.
patent: 6507215 (2003-01-01), Piasecki et al.
patent: 6509758 (2003-01-01), Piasecki et al.
patent: 6614260 (2003-09-01), Welch et al.
patent: 6738858 (2004-05-01), Fernald et al.
patent: 6768337 (2004-07-01), Kohno et al.
patent: 2001/0043081 (2001-11-01), Rees
patent: 2002/0121679 (2002-09-01), Bazarjani et al.
patent: 2004/0054821 (2004-03-01), Warren et al.
Morrison, Gale, “IBM Eyes Merchant Packaging Services,” Jul. 13, 1998, Electronic News, available at http://www.findarticles.com.
Charles, Jr., H.K.,et al., “Wirebonding: Reinventing the Process from MCMs,” Apr. 15-17, 1998, IEEE 7th International Conference on Multichip Modules and High Density Packaging, p. 300-302.
Tran, T.A., et al., “Fine Pitch and Wirebonding and Reliability of Aluminum Capped Copper Bond Pads,” May 21-24, 2000, IEE Electronic Components and Technology Conference, p. 1674-1680.
CYPR-CD00187; “A Configurable Input/Output Interface for a Microcontroller”; Sep. 14, 2001; U.S Appl. No. 09/953,423; Kutz et al.
Kutz Harold
Mar Monte
Snyder Warren
Auve Glenn A.
Cypress Semiconductor Corporation
Mason Donna K.
Wagner , Murabito & Hao LLP
LandOfFree
Multiple use of microcontroller pad does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multiple use of microcontroller pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple use of microcontroller pad will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3501314