Multiple substrate processing apparatus for enhanced throughput

Details Multiple substrate processing apparatus for enhanced throughput Multiple substrate processing apparatus for enhanced throughput

1997-02-21

2000-10-17

Beck, Shrive

Coating apparatus

Gas or vapor deposition

Multizone chamber

118715, 118725, 118729, 118730, 156345, C23C 1600

Patent

active

061325171

ABSTRACT:
A dual wafer processing apparatus (4) includes a chamber housing (14) defining an interior and having upper, lower and central portions (18, 20, 16). An electrostatic chuck (34) has electrostatic chucking surfaces (38, 40) on opposite sides. The chuck is rotatably mounted within the chamber housing so that the chucking surfaces face the upper and lower portions of the chamber housing. After a wafer (36) is positioned on a chucking surface, electrostatic forces are used to maintain the wafer secured to the chucking surface. The chuck is then rotated 180.degree. to permit placement of a second wafer on the second chucking surface. Processing of the two wafers occurs simultaneously. Electrostatic chucking surfaces could be replaced by mechanical wafer clamps.

REFERENCES:
patent: 4113547 (1978-09-01), Katz et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5000113 (1991-03-01), Wang et al.
patent: 5001594 (1991-03-01), Bobbio
patent: 5037262 (1991-08-01), Moll et al.
patent: 5099571 (1992-03-01), Logan et al.
patent: 5166856 (1992-11-01), Liporace et al.
patent: 5292554 (1994-03-01), Sinha et al.
patent: 5315473 (1994-05-01), Collins et al.
patent: 5316645 (1994-05-01), Yamagami et al.
patent: 5325261 (1994-06-01), Horwitz
patent: 5382803 (1995-01-01), Asakawa
patent: 5427620 (1995-06-01), deBoer et al.
patent: 5431737 (1995-07-01), Keller et al.
patent: 5452510 (1995-09-01), Barnes et al.
patent: 5460703 (1995-10-01), Nulman et al.
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5486975 (1996-01-01), Shamouilian et al.
patent: 5491603 (1996-02-01), Birang et al.
patent: 5518644 (1996-05-01), Cheung et al.
patent: 5521790 (1996-05-01), Ruchel et al.
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5571366 (1996-11-01), Ishii et al.
patent: 5855681 (1999-01-01), Maydan et al.
patent: 5946184 (1999-08-01), Kanno et al.

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