Multiple stage electroless deposition of a metal layer

Details Multiple stage electroless deposition of a metal layer Multiple stage electroless deposition of a metal layer

2006-05-23

2006-05-23

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S680000

Reexamination Certificate

active

07049234

ABSTRACT:
A multiple stage method of electrolessly depositing a metal layer is presented. This method may have the two main stages of first forming a thin metal layer on a metal surface using an electroless plating solution containing activating agents that are highly reactive reducing agents, and second, forming a bulk metal layer over the thin metal layer by using an electroless plating solution containing mildly reactive reducing agents. Through this two stage method, the use of highly reactive reducing agents that may cause the formation of contaminant particles may be minimized. By minimizing the formation of contaminant particles in the electroless plating solution, the lifetime of the solution may be extended and the current leakage between metal interconnect lines may be reduced.

REFERENCES:
patent: 5374454 (1994-12-01), Bickford et al.
patent: 5709906 (1998-01-01), Bickford et al.
patent: 5730890 (1998-03-01), Bickford et al.
patent: 5800858 (1998-09-01), Bickford et al.

Affiliated with

Also associated with

Rating

Multiple stage electroless deposition of a metal layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple stage electroless deposition of a metal layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple stage electroless deposition of a metal layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3573147