Multiple pole electrostatic chuck with self healing mechanism fo

Details Multiple pole electrostatic chuck with self healing mechanism fo Multiple pole electrostatic chuck with self healing mechanism fo

1998-02-05

1999-09-14

Gaffin, Jeffrey

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

279128, H02N 1300

Patent

active

059532009

ABSTRACT:
An electrostatic chuck device for clamping a semiconductor wafer substrate during processing of the semiconductor wafer includes a power source, at least one negative pole, and a plurality of positive poles. Each positive pole selected from the plurality of positive poles is electrically separated from the negative pole. Also provided is a plurality of fuses, each fuse of the plurality of fuses is coupled to an associated positive pole included in the plurality of positive poles. Each fuse is further coupled to the power source. In some embodiments, each positive pole is electrically separated from the negative pole by an insulating epoxy. In other embodiments, the plurality of positive poles are connected to each other in parallel.

REFERENCES:
patent: 5413360 (1995-05-01), Atari et al.
patent: 5691876 (1997-11-01), Chen et al.
patent: 5737178 (1998-04-01), Herchen
patent: 5751537 (1998-05-01), Kumar et al.
patent: 5835335 (1998-11-01), Ross et al.
John Field, "Wafer Temperature Control: Advanced Solutions for Next Generation Manufacturing", Oct. 14, 1997, Lam Research Corp., Fremont, Ca.

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