Multiple internal seal ring micro-electro-mechanical system...

Details Multiple internal seal ring micro-electro-mechanical system... Multiple internal seal ring micro-electro-mechanical system...

2007-09-05

2008-07-08

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Etching of semiconductor material to produce an article...

C216S013000, C216S041000, C438S455000, C438S456000, C257S659000, C257S660000

Reexamination Certificate

active

07396478

ABSTRACT:
A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum packaging method that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings to a base plate having metal seal rings by wafer bonding the capping plate wafer to the base plate wafer. Bulk electrodes may be used to provide conductive paths between the seal rings on the base plate and the capping plate. All seals are made using only metal-to-metal seal rings deposited on the polished surfaces of the base plate and capping plate wafers. However, multiple electrical feed-through metal traces are provided by fabricating via holes through the capping plate for electrical connection from the outside of the package through the via-holes to the inside of the package. Each metal seal ring serves the dual purposes of hermetic sealing and providing the electrical feed-through metal trace.

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patent: 6257057 (2001-07-01), Hulsing, II
patent: 6479320 (2002-11-01), Gooch
patent: 6944931 (2005-09-01), Shcheglov et al.

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