Multiple flip-chip integrated circuit package system

Details Multiple flip-chip integrated circuit package system Multiple flip-chip integrated circuit package system

2011-07-12

2011-07-12

Patel, Ishwarbhai B (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C029S832000, C257S686000

Reexamination Certificate

active

07977579

ABSTRACT:
An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.

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