Multiple field of view calibration plate for use in semiconducto

Optics: measuring and testing – Standard

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3562376, G01N 2100

Patent

active

059780819

ABSTRACT:
An article of manufacture is provided both for coordinating multiple fields of view of a plurality of cameras so as to facilitate determining the distance between features on a semiconductor wafer, each feature being disposed within a different field of view, and for correcting image distortion within each field of view. The article of the invention includes a substantially rigid dimensionally-stable substrate, such as a plate, having a plurality of image distortion calibration targets, that are each located at a known relative position. In semiconductor wafer applications, each calibration target is disposed on the substrate so the target is in the field of view of a camera positioned to include a portion of the edge of the semiconductor wafer at run-time. In a preferred embodiment, each calibration target is disposed at an orientation angle such that a first principle axis of the calibration target is perpendicular to a tangent to the perimeter of the semiconductor wafer. In semiconductor wafer applications, it is preferred that a surface of the substrate be of a size and shape such that each calibration target disposed on the substrate can be in the field of view of a camera positioned to include a portion of the edge of the semiconductor wafer at run-time. In a preferred embodiment, the substrate includes physical alignment features that facilitate coordination of the multi-camera coordinate system of the article of the invention with the coordinate system of a semiconductor manufacturing machine.

REFERENCES:
patent: 4557589 (1985-12-01), Zimring
patent: 4557599 (1985-12-01), Zimring
patent: 5113565 (1992-05-01), Cipolla et al.
patent: 5145432 (1992-09-01), Midland et al.
patent: 5528290 (1996-06-01), Saund

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