Multiple connection bond pad for an integrated circuit device an

Details Multiple connection bond pad for an integrated circuit device an Multiple connection bond pad for an integrated circuit device an

1983-10-27

1985-12-10

James, Andrew J.

357 65, 357 70, 357 80, H01L 2312, H01L 2552

Patent

active

045583455

ABSTRACT:
A bond region is provided on an integrated circuit chip wherein the bond region has two or more sets of closely spaced conductors, each of which is electrically connected to a different point of the integrated circuit. During the manufacturing of the device, at the time of assembly of the chip into the package one end of a connector wire may, optionally, be bonded to the bond region thereby effecting a multiple connection of these different points of the integrated circuit. Such a procedure will enable a specific mode of operation of a multi-mode device.

REFERENCES:
patent: 3673427 (1972-06-01), McCoy et al.
patent: 4091529 (1978-05-01), Zaleckas
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4204218 (1980-05-01), Fox et al.
patent: 4223337 (1980-09-01), Kojima et al.
patent: 4301464 (1981-11-01), Otsuki et al.

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