Multiple-chip semiconductor device and a method of manufacturing

Details Multiple-chip semiconductor device and a method of manufacturing Multiple-chip semiconductor device and a method of manufacturing

1993-01-29

1994-05-17

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

Small lead frame for connecting a large lead frame to a...

257666, 257723, 257724, 257676, 257691, 257782, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053130952

ABSTRACT:
A multiple-chip semiconductor device of the present invention comprises a first and a second leadframes. The same package envelops a power semiconductor chip mounted on a power chip mounting area in the first leadframe and a control chip mounted on a control chip mounting area in the second leadframe. In the device, the second leadframe is made of metal material which is processed easier than the first leadframe, and/or is finished thinner than the first leadframe. Thus, the multiple-chip semiconductor device can effectively dissipate the heat producing in the power semiconductor chip.

REFERENCES:
patent: 4633582 (1987-01-01), Ching et al.
patent: 4794431 (1988-12-01), Park
patent: 5049527 (1991-09-01), Merrick et al.
patent: 5049977 (1991-09-01), Sako
patent: 5057906 (1991-10-01), Ishigami
patent: 5147815 (1992-09-01), Casto

Affiliated with

Also associated with

Rating

Multiple-chip semiconductor device and a method of manufacturing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multiple-chip semiconductor device and a method of manufacturing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multiple-chip semiconductor device and a method of manufacturing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-879267