Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2011-03-08
2011-03-08
Arora, Ajay K (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S076000, C257S686000, C257SE23042, C438S123000, C438S109000
Reexamination Certificate
active
07902646
ABSTRACT:
Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dies and at least nine parallel leads. The dies are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.
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patent: 2008/0024102 (2008-01-01), Hebert et al.
patent: 2008/0061396 (2008-03-01), Havanur
patent: 2009/0160036 (2009-06-01), Grey
patent: 2009/0189262 (2009-07-01), Liu et al.
patent: 2009/0189266 (2009-07-01), Liu et al.
patent: 2009/0189273 (2009-07-01), Liu et al.
Liu Yong
Maldo Tiburcio A.
Yang Hua
Arora Ajay K
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
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