Multiphase synchronous buck converter

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Details

C257S076000, C257S686000, C257SE23042, C438S123000, C438S109000

Reexamination Certificate

active

07902646

ABSTRACT:
Disclosed in this specification is a multiphase buck converter package and process for forming such package. The package includes at least four dies and at least nine parallel leads. The dies are electrically connected through a plurality of die attach pads, thus eliminating the need for wirebonding.

REFERENCES:
patent: 6803750 (2004-10-01), Zhang
patent: 2007/0249092 (2007-10-01), Joshi
patent: 2008/0024102 (2008-01-01), Hebert et al.
patent: 2008/0061396 (2008-03-01), Havanur
patent: 2009/0160036 (2009-06-01), Grey
patent: 2009/0189262 (2009-07-01), Liu et al.
patent: 2009/0189266 (2009-07-01), Liu et al.
patent: 2009/0189273 (2009-07-01), Liu et al.

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