Multimedia chip package

Details Multimedia chip package Multimedia chip package

2002-08-19

2003-04-01

Picardat, Kevin M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S111000, C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

06541307

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to packaging techniques, and more particularly, to a multimedia chip package and a fabrication method thereof.
2. Description of the related Art
Because of the rapid development of information technology, integrated circuits have become essential for daily use. Products formed by integrated circuits appear in all aspects of daily life. Semiconductor technology is continuously developing to be more personal and functional, and complex new electronic products are constantly being developed. As a result, a major trend in the semiconductor industry is to make products even lighter, thinner, smaller and faster, while also making them friendly, convenient, powerful, reliable and increasingly less expensive.
In semiconductor fabrication, semiconductor devices are entering the submicron century by producing 0.18 &mgr;m integrated circuits. As a matter of fact, a much higher-density integrated circuit now can be produced. The fabrication process of an integrated circuit can be separated into three different processes: a fabricating process of a silicon wafer, a fabricating process of an integrated circuit and a packaging process of the integrated circuit. The packaging process of the integrated circuit is the final step for completing the integrated circuit product, and the main purpose of this packaging step is to establish electrical connections from a die to a printed circuit board (PCB) or other devices. Moreover, the packaging process can protect the chips.
A multimedia chip (MMC) package consists of an application-specific integrated circuit (ASIC) controller and a flash memory. The multimedia chip package is usually very thin in order to be applied to MMC products. However, the cost of the multimedia chip package is very high, and the process yield is not good.
FIG. 1
illustrates a cross-sectional view of a conventional MMC package.
FIG. 1A
is a top view diagram of FIG.
1
. In the conventional fabrication process of a MMC package, a substrate (not shown in the diagrams) is provided, which substrate comprises a plurality of substrate units
110
(only one substrate unit is shown in
FIG. 1
) and connecting bars (not shown in the diagrams). Each substrate unit
110
comprises an upper surface
112
and a corresponding lower surface
114
. A plurality of external nodes
116
is located at the periphery of the upper surface
112
of the substrate unit
10
and is also called gold pins. The external nodes
116
can be electrically connected to external circuits. The lower surface
114
of the substrate unit
110
comprises a plurality of die pads and a plurality of nodes
120
. At least a multimedia chip
180
has an active surface
182
and a corresponding back surface
184
. A plurality of bonding pads
186
is formed on the active surface
182
of the multimedia chip
180
.
A die attaching process is carried out to adhere the back surface
184
of the multimedia chip
180
onto the die pad
118
of the substrate unit
110
. A plurality of conductive wires
190
electrically connects the bonding pads
186
to the nodes
120
. A molding process is carried out next to encapsulate the multimedia chip
180
, conductive wires
190
and portions of the lower surface
114
of the substrate units
110
with a molding compound
130
. A plurality of packaging units
188
is thus formed (one of the package units is shown in the FIG.
1
). Each packaging unit
188
corresponds to each substrate unit
110
. A singulation process is carried out to separate each packaging unit by punching or sawing, whereby packaging units are separated from connecting bars. A quality control test is carried out to detect whether or not each packaging unit
188
passes the quality standards. A process of adding a cap to the package unit comprises the following steps. First, an adhesive material
160
is applied on the cap
150
, and then the cap
150
with the adhesive material
160
covers the molding compound
130
and a portion of the lower surface
114
of the substrate unit
110
. After pressing and heating processes, the cap
150
is firmly secured onto the package unit
188
. Finally, a label
152
is adhered on the surface of the cap
150
.
From the above-mentioned packaging process, the thickness of the substrate
110
can be approximately 0.3 mm because the thickness of the whole package unit is only approximately 1.4 mm. Therefore the thickness of the substrate has to be very thin, which leads to a warpage problem. This can also lead to a delamination problem, thus affecting the production yield and increasing the cost. The process of adding a cap to the substrate unit is complex, and the material cost of the cap
150
and the adhesive material
160
can increase the production cost. The tolerance between the cap and the package unit, and the adhesive ability between the cap, the adhesive material and the substrate unit
110
can be a problem. Excess adhesive material overflows onto the outer surface of the package unit; therefore, the reliability of the product decreases.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide an improved method for packaging a multimedia chip package without a cap. Since the step of adding a cap is omitted, the whole fabrication process of the multimedia chip package is thus simplified. Therefore, the cost can be reduced, and the production yield is improved.
It is another object of the present invention to provide an improved method and fabrication process for reducing the volume of a multimedia chip package.
To achieve the foregoing and other objects and in accordance with the purpose of the present invention, a multimedia chip package is provided. The multimedia chip package comprises: a substrate unit having a first surface and a corresponding second surface, wherein a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit; a plurality of external nodes is formed on the second surface of the substrate unit and electrically connected to the nodes; at least a multimedia chip having an active surface and a corresponding back surface, wherein a plurality of bonding pads is formed on the active surface of the multimedia chip, the back surface of the multimedia chip is adhered on the die pad of the substrate unit and the bonding pads are electrically connected to the nodes by a plurality of conductive wires; and a molding compound encapsulating the multimedia chip, the first surface of the substrate unit, the conductive wires, and exposing the second surface of the substrate unit and the external nodes.
According to one of the preferred embodiments of the present invention, the external nodes are located near a peripheral region of the second surface of the substrate unit. The shape of the external nodes can be rectangular and square. A label is adhered on the surface of the molding compound.
To achieve the foregoing and other objects and in accordance with the purpose of the present invention, a method of fabricating a multimedia chip package is provided, comprising the following steps. A substrate is provided, which comprises a plurality of connecting bars and at least a package unit. The connecting bars surround the periphery of the package unit, and each package unit contains a substrate unit. The substrate unit has a first surface and a corresponding second surface, and at least a die pad and a plurality of nodes are formed on the first surface of the substrate unit. A plurality of external nodes is formed on the second surface of the substrate unit, and the external nodes are electrically connected to the nodes. At least a multimedia chip is provided and has an active surface and a corresponding back surface. A plurality of bonding pads is formed on the active surface of the multimedia chip. The back surface of the multimedia chip is adhered on the die pad. A wire bonding process is carried out to electrically connect the bonding pads to the nodes. A molding process is carried out in which a mold has at l

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