Multileveled electronic assembly with cooling means

Details Multileveled electronic assembly with cooling means Multileveled electronic assembly with cooling means

1990-03-19

1991-11-05

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361382, 361383, 361385, 165 803, 174 151, H05K 720

Patent

active

050634755

ABSTRACT:
An electronic assembly (e.g., a supercomputer) wherein different levels of substrates, each having a plurality of heat-generating electronic components (e.g., resistors, capacitors, power supplies, VLSI modules) thereon, is described. The assembly includes a cooling structure centrally disposed therein for providing cooling fluid to each of the heat generating components to cool same. In a preferred embodiment, the cooling structure comprises a plurality of concentrically disposed duct members (e.g., of thermoplastic), which each in turn include a longitudinal chamber portion and a flared end portion. The flared end portion is particularly designed to direct the cooling fluid in a plurality of directions, depending on the requirements of the assembly. Diffusing structure (e.g., an apertured plate) may also be used to assure passage of turbulent, even fluid flow through each duct member.

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IBM TDB, vol. 14, No. 2, Jul. 1971, p. 468, Central Air Cooling System.
IBM TDB, vol. 19, No. 2, May 1977, pp. 4489-4490, Multilayer Electronics Package.
IBM TDB, vol. 31, No. 5, Oct. 1988, pp. 44-47, Forced Convection Downward Flow Cooling System.

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