Techniques for providing high I/O count connections to semicondu

Details Techniques for providing high I/O count connections to semicondu Techniques for providing high I/O count connections to semicondu

1993-03-18

1994-08-23

Thomas, Tom

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437220, H01L 2160

Patent

active

053407717

ABSTRACT:
Techniques for providing semiconductor packages capable of forming connections to "high I/O" semiconductor dies is described, wherein there are at least two distinct pluralities of conductive lines. Leadframe-type packages and substrate-based package embodiments are described.

REFERENCES:
patent: 3200364 (1993-04-01), Loh
patent: 4897708 (1990-01-01), Clements
patent: 4987100 (1991-01-01), McBride et al.
patent: 5034349 (1991-07-01), Landis
patent: 5172214 (1992-12-01), Casto
patent: 5206188 (1993-04-01), Hiroi et al.
Computer Design, ASICs & ASIC Design Tools, Oct., 1991 Emphasis Shifts From Density To I/O In Low-Density Arrays, Barbara Tuck, Senior Editor, pp. 42 and 45.

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