Multilevel semiconductor integrated circuit device

Details Multilevel semiconductor integrated circuit device Multilevel semiconductor integrated circuit device

1995-07-21

1997-07-29

Jackson, Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257777, 361735, H01L 2302

Patent

active

056524625

ABSTRACT:
Two modules, each of which has a plurality of memory IC chips installed therein, are stacked to form a module unit. Furthermore, a plurality of the module units are installed on a mother board so as to form a multilevel semiconductor integrated circuit device. By further stacking a specific module containing an IC chip for replacing the functions of a defective chip, a repair process can be conducted more easily and efficiently. Alternatively, instead of the module units, a plurality of TAB packages stacked in a multilayer structure are installed on the mother board. Outer leads of each of the TAB packages and terminal pads on the circuit board are respectively connected to each other in a one-to-one way. Thus, only a defective TAB package need be taken away and consequently, efficiency in the repair process further improves.

REFERENCES:
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4996583 (1991-02-01), Hatada
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5394300 (1995-02-01), Yoshimura
patent: 5490041 (1996-02-01), Furukawa et al.

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