Multilevel interconnect structure for integrated circuits

Details Multilevel interconnect structure for integrated circuits Multilevel interconnect structure for integrated circuits

1998-04-14

2000-01-04

Niebling, John F.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257767, 257758, 257741, H01L 2348

Patent

active

060113111

ABSTRACT:
A multilevel interconnect structure includes a lower conducting layer, a dielectric layer formed on the lower conducting layer, an upper conducting layer formed partly on the dielectric layer, and an I-shaped via plug for electrically connecting the lower conducting layer and the upper conducting layer. The I-shaped via plug has an upper portion which laterally extends into the upper conducting layer, and a lower portion which undercuts the lower conducting layer.

REFERENCES:
patent: 4916002 (1990-04-01), Carver
patent: 5434452 (1995-07-01), Higgins, III
patent: 5438223 (1995-08-01), Higashi et al.
patent: 5619071 (1997-04-01), Myers et al.

Affiliated with

Also associated with

Rating

Multilevel interconnect structure for integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilevel interconnect structure for integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilevel interconnect structure for integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1074731