Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-11-22
2005-11-22
Sarkar, Asok Kumar (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S672000
Reexamination Certificate
active
06967152
ABSTRACT:
A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.
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NanoNexus, www.nanonexus.com/pages/products, Nov. 8, 2002, “Cost Effective Electrical Connections For Advanced IC's”.
Bak Mikhail P.
Jordan Phillip L.
Ketterl Joseph R.
Strole Jeffery A.
Yarno John P.
Law Office of Timothy E. Siegel
MicroConnex Corp.
Sarkar Asok Kumar
Siegel Timothy E.
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