Multilevel copper interconnects with low-k dielectrics and...

Details Multilevel copper interconnects with low-k dielectrics and... Multilevel copper interconnects with low-k dielectrics and...

2006-08-15

2006-08-15

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S759000, C257S760000, C438S421000, C438S422000, C438S619000, C438S622000, C438S623000, C438S624000

Reexamination Certificate

active

07091611

ABSTRACT:
Structures and methods are provided for an improved multilevel wiring interconnect in an integrated circuit assembly. The present invention provides for a multilayer copper wiring structure by electroless, selectively deposited copper in a streamlined process which further reduces both intra-level line to line capacitance and the inter-level capacitance.In particular, an illustrative embodiment of the present invention includes a novel methodology for forming multilevel wiring interconnects in an integrated circuit assembly. The method includes forming a number of multilayer metal lines, e.g. copper lines formed by selective electroless plating, separated by air gaps above a substrate. A low dielectric constant material is deposited between the number of metal lines and the substrate using a directional process. According to the teachings of the present invention, using a directional process includes maintaining a number of air gaps in the low dielectric constant material. Structures and systems are similarly included in the present invention.

REFERENCES:
patent: 3337334 (1967-08-01), Fenn et al.
patent: 3548915 (1970-12-01), Richmond et al.
patent: 3832456 (1974-08-01), Kobetz et al.
patent: 3923500 (1975-12-01), Kitazawa et al.
patent: 3932226 (1976-01-01), Klatskin et al.
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4022931 (1977-05-01), Black et al.
patent: 4029377 (1977-06-01), Guglielmi
patent: 4065330 (1977-12-01), Masumoto et al.
patent: 4101855 (1978-07-01), Drapeau
patent: 4158719 (1979-06-01), Frantz
patent: 4233066 (1980-11-01), Sundin et al.
patent: 4314594 (1982-02-01), Pfeifer et al.
patent: 4386116 (1983-05-01), Nair et al.
patent: 4389429 (1983-06-01), Soclof
patent: 4394223 (1983-07-01), Hall
patent: 4423547 (1984-01-01), Farrar et al.
patent: 4565157 (1986-01-01), Brors et al.
patent: 4574095 (1986-03-01), Baum et al.
patent: 4591173 (1986-05-01), Marier
patent: 4670297 (1987-06-01), Lee et al.
patent: 4709359 (1987-11-01), Loftin
patent: 4762728 (1988-08-01), Keyser et al.
patent: 4788082 (1988-11-01), Schmitt
patent: 4847111 (1989-07-01), Chow et al.
patent: 4857481 (1989-08-01), Tam et al.
patent: 4931410 (1990-06-01), Tokunaga et al.
patent: 4948459 (1990-08-01), van Laarhoven et al.
patent: 4962058 (1990-10-01), Cronin et al.
patent: 4996584 (1991-02-01), Young et al.
patent: 5019531 (1991-05-01), Awaya et al.
patent: 5034799 (1991-07-01), Tomita et al.
patent: 5045635 (1991-09-01), Kaplo et al.
patent: 5084412 (1992-01-01), Nakasaki
patent: 5100499 (1992-03-01), Douglas
patent: 5130274 (1992-07-01), Harper et al.
patent: 5148260 (1992-09-01), Inoue et al.
patent: 5149615 (1992-09-01), Chakravorty et al.
patent: 5158986 (1992-10-01), Cha et al.
patent: 5173442 (1992-12-01), Carey
patent: 5227658 (1993-07-01), Beyer et al.
patent: 5231036 (1993-07-01), Miyauchi et al.
patent: 5231056 (1993-07-01), Sandhu
patent: 5232866 (1993-08-01), Beyer et al.
patent: 5240878 (1993-08-01), Fitzsimmons et al.
patent: 5243222 (1993-09-01), Harper et al.
patent: 5256205 (1993-10-01), Schmitt, III et al.
patent: 5268315 (1993-12-01), Prasad et al.
patent: 5308440 (1994-05-01), Chino et al.
patent: 5324683 (1994-06-01), Fitch et al.
patent: 5324684 (1994-06-01), Kermani et al.
patent: 5334356 (1994-08-01), Baldwin et al.
patent: 5336914 (1994-08-01), Andoh
patent: 5354712 (1994-10-01), Ho et al.
patent: 5356672 (1994-10-01), Schmitt, III et al.
patent: 5371042 (1994-12-01), Ong
patent: 5384284 (1995-01-01), Doan et al.
patent: 5399897 (1995-03-01), Cunningham et al.
patent: 5408742 (1995-04-01), Zaidel et al.
patent: 5413687 (1995-05-01), Barton et al.
patent: 5413962 (1995-05-01), Lur et al.
patent: 5424030 (1995-06-01), Takahashi
patent: 5426330 (1995-06-01), Joshi et al.
patent: 5442237 (1995-08-01), Hughes et al.
patent: 5444015 (1995-08-01), Aitken et al.
patent: 5447887 (1995-09-01), Filipiak et al.
patent: 5457344 (1995-10-01), Bartelink
patent: 5470789 (1995-11-01), Misawa
patent: 5470801 (1995-11-01), Kapoor et al.
patent: 5476817 (1995-12-01), Numata
patent: 5485037 (1996-01-01), Marrs
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5506449 (1996-04-01), Nakano et al.
patent: 5510645 (1996-04-01), Fitch et al.
patent: 5529956 (1996-06-01), Morishita
patent: 5534731 (1996-07-01), Cheung
patent: 5538922 (1996-07-01), Cooper et al.
patent: 5539060 (1996-07-01), Tsunogae et al.
patent: 5539227 (1996-07-01), Nakano
patent: 5578146 (1996-11-01), Grant et al.
patent: 5595937 (1997-01-01), Mikagi
patent: 5609721 (1997-03-01), Tsukune et al.
patent: 5625232 (1997-04-01), Numata et al.
patent: 5635253 (1997-06-01), Canaperi et al.
patent: 5654245 (1997-08-01), Allen
patent: 5662788 (1997-09-01), Sandhu et al.
patent: 5667600 (1997-09-01), Grensing et al.
patent: 5668398 (1997-09-01), Havemann et al.
patent: 5670420 (1997-09-01), Choi
patent: 5674787 (1997-10-01), Zhao et al.
patent: 5675187 (1997-10-01), Numata et al.
patent: 5679608 (1997-10-01), Cheung et al.
patent: 5681441 (1997-10-01), Svendsen et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5705425 (1998-01-01), Miura et al.
patent: 5719089 (1998-02-01), Cherng et al.
patent: 5719410 (1998-02-01), Suehiro et al.
patent: 5725689 (1998-03-01), Nishida et al.
patent: 5739579 (1998-04-01), Chiang et al.
patent: 5759906 (1998-06-01), Lou
patent: 5763953 (1998-06-01), IIjima et al.
patent: 5780358 (1998-07-01), Zhou et al.
patent: 5785570 (1998-07-01), Bruni
patent: 5792522 (1998-08-01), Jin et al.
patent: 5792706 (1998-08-01), Michael et al.
patent: 5801098 (1998-09-01), Fiordalice et al.
patent: 5814557 (1998-09-01), Venkatraman et al.
patent: 5821168 (1998-10-01), Jain
patent: 5824599 (1998-10-01), Schacham-Diamand et al.
patent: 5852871 (1998-12-01), Khandros
patent: 5858877 (1999-01-01), Dennison et al.
patent: 5880018 (1999-03-01), Boeck et al.
patent: 5891797 (1999-04-01), Farrar
patent: 5891804 (1999-04-01), Havemann et al.
patent: 5893752 (1999-04-01), Zhang et al.
patent: 5895740 (1999-04-01), Chien et al.
patent: 5897370 (1999-04-01), Joshi et al.
patent: 5900668 (1999-05-01), Wollesen
patent: 5907772 (1999-05-01), Iwasaki
patent: 5911113 (1999-06-01), Yao et al.
patent: 5913147 (1999-06-01), Dubin et al.
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5930596 (1999-07-01), Klose et al.
patent: 5930669 (1999-07-01), Uzoh
patent: 5932928 (1999-08-01), Clampitt
patent: 5933758 (1999-08-01), Jain
patent: 5940733 (1999-08-01), Beinglass et al.
patent: 5948467 (1999-09-01), Nguyen et al.
patent: 5953626 (1999-09-01), Hause et al.
patent: 5962923 (1999-10-01), Xu et al.
patent: 5968333 (1999-10-01), Nogami et al.
patent: 5969422 (1999-10-01), Ting et al.
patent: 5972179 (1999-10-01), Chittipeddi et al.
patent: 5972804 (1999-10-01), Tobin et al.
patent: 5976710 (1999-11-01), Sachdev et al.
patent: 5981350 (1999-11-01), Geusic et al.
patent: 5985759 (1999-11-01), Kim et al.
patent: 5989623 (1999-11-01), Chen et al.
patent: 5994776 (1999-11-01), Fang et al.
patent: 5994777 (1999-11-01), Farrar
patent: 6001730 (1999-12-01), Farkas et al.
patent: 6008117 (1999-12-01), Hong et al.
patent: 6015465 (2000-01-01), Kholodenko et al.
patent: 6015738 (2000-01-01), Levy et al.
patent: 6017820 (2000-01-01), Ting et al.
patent: 6022802 (2000-02-01), Jang
patent: 6025261 (2000-02-01), Farrar et al.
patent: 6030877 (2000-02-01), Lee et al.
patent: 6037248 (2000-03-01), Ahn
patent: 6054172 (2000-04-01), Robinson et al.
patent: 6057226 (2000-05-01), Wong
patent: 6059553 (2000-05-01), Jin et al.
patent: 6065424 (2000-05-01), Shacham-Diamand et al.
patent: 6069068 (2000-05-01), Rathore et al.
patent: 6071810 (2000-06-01), Wada et al.
patent: 6075278 (2000-06-01), Farrar
patent: 6075287 (2000-06-01), Ingraham et al.
patent: 6091136 (2000-07-01), Jiang et al.
patent: 6091475 (2000-07-01), Ogino et al.
patent: 6100193 (2000-08-01), Suehiro et al.
patent: 6121126 (2000-09-01), Ahn et al.
patent: 6126989 (2000-10-01), Robinson et al.
patent: 6136095 (2000-10-01), Xu et al.
patent: 6136680 (2000-10-01), Lai et al.
patent: 6139699 (2000-10-01), Chiang et al.
patent: 6140228 (2000-10-01), Shan et al.
patent: 6140234

Affiliated with

Also associated with

Rating

Multilevel copper interconnects with low-k dielectrics and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilevel copper interconnects with low-k dielectrics and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilevel copper interconnects with low-k dielectrics and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3675137