Multilayered wiring board, semiconductor device in which...

Details Multilayered wiring board, semiconductor device in which... Multilayered wiring board, semiconductor device in which...

2006-10-04

2011-10-18

Semenenko, Yuriy (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C361S763000, C257S737000

Reexamination Certificate

active

08039756

ABSTRACT:
A multilayered wiring board has electrodes disposed on a first surface and a second surface, alternately layered insulation layers and wiring layers, and vias that are disposed in the insulation layer and electrically connect the wiring layers. The second electrode disposed on the second surface is embedded in the insulation layer exposed on said second surface, and the second wiring layer covered by the insulation layer exposed on said second surface does not have a layer for improving adhesion to the insulation layer.

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