Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate
2001-01-25
2003-04-29
Pascal, Robert (Department: 2817)
Wave transmission lines and networks
Coupling networks
With impedance matching
C333S032000, C333S246000
Reexamination Certificate
active
06556099
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to multilayer ceramic devices, and more particularly to multilayer tapered transmission line devices suitable for large bandwidth applications.
BACKGROUND OF THE INVENTION
It is popular in the art to employ transmission lines for signal propagation through the layers of a multilayer ceramic package. For instance, it is common to build multiple layers of such devices by screen printing a conductive paste (e.g., including silver, gold, copper, nickel, palladium, platinum or the like) on layers of a ceramic green tape according to a predetermined pattern. The layers are co-fired to form a dense ceramic package. Vias are typically formed for bridging electrical communication between conductive layers.
In many radio frequency applications, there is a need for impedance matching over a broad range of frequencies. One desirable approach is to employ a tapered transmission line, as is known in the art. However, it has been found that ceramic packaging size constraints have prohibited the optimal design of tapered transmission line devices. Accordingly, there is a need for an improved impedance matching transformer, which is useful over a broad range of frequencies and which can be incorporated into multilayer ceramic packaging for minute size applications.
Illustrative examples of other technological advances in the present general field include that disclosed in U.S. Pat. Nos. 5,119,048; 5,140,288; 5,949,304; and 5,977,850, all of which are hereby expressly incorporated by reference.
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Burrows, C.R., “The exponential transmission line,” Bell System Technical Journal, vol. 17, pp. 555-573, (Oct. 1938).
Mandai & Chigodo, “A low temperature cofired multiplayer ceramic delay line with copper conductors,” Electronic Components and Technology Conference Proceedings 1991, pp. 127-133.
Bickham Richard S.
Cygan Lawrence F.
Khan Andrew Merritt
Mukherjee Shamik
Jones Stephen E.
Pascal Robert
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