Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2007-03-27
2007-03-27
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257SE23062, C257S700000, C257S701000, C257S758000, C257S704000, C257S707000, C257S710000, C257S787000, C257S788000, C257S079000, C257S712000, C257S713000, C257S720000, C257S717000, C257SE23178, C257SE23007, C257SE23067, C257SE23069, C257SE23063
Reexamination Certificate
active
10995384
ABSTRACT:
A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
REFERENCES:
patent: 6191483 (2001-02-01), Loo
patent: 6418615 (2002-07-01), Rokugawa et al.
patent: 2001/0003049 (2001-06-01), Fukusawa et al.
patent: 2002/0001937 (2002-01-01), Kikuchi et al.
patent: 2000-323613 (2000-11-01), None
patent: 2003-23613 (2000-11-01), None
patent: 1999-63586 (1999-07-01), None
Aratani Hironari
Chino Takeshi
Kodaira Tadashi
Matsumoto Shun-ichiro
Nakamura Jyunichi
Morgan & Lewis & Bockius, LLP
Shinko Electric Industries Co. Ltd.
Williams Alexander Oscar
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