Multilayered lead frame for semiconductor package

Details Multilayered lead frame for semiconductor package Multilayered lead frame for semiconductor package

1999-12-13

2000-11-28

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257675, H01L 23495

Patent

active

061539244

ABSTRACT:
A multi layered semiconductor lead frame, and a semiconductor package fabricated using the lead frame are provided. The lead frame includes a lead plate having multiple die mounting sites configured for molding multiple semiconductor packages. The lead plate includes lead fingers that form the terminal leads and internal signal traces for the molded packages. Each package includes a die mounting plate, and a ring plate attached to opposing sides of a portion of the lead plate. The die mounting plates and ring plates provide ground or voltage planes for the packages. In addition, the die mounting plates and ring plates provide improved heat transfer, reduced inductance, and matched impedance for the packages.

REFERENCES:
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4835120 (1989-05-01), Mallik et al.
patent: 5043534 (1991-08-01), Mahulikar et al.
patent: 5089878 (1992-02-01), Lee
patent: 5220195 (1993-06-01), McShane et al.
patent: 5498901 (1996-03-01), Chillara et al.
patent: 5548160 (1996-08-01), Corbett et al.
patent: 5559306 (1996-09-01), Mahulikar
patent: 5629561 (1997-05-01), Shin et al.
patent: 5666003 (1997-09-01), Shibata et al.
patent: 5672548 (1997-09-01), Culmane et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5767572 (1998-06-01), Fujitsu

Affiliated with

Also associated with

Rating

Multilayered lead frame for semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multilayered lead frame for semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered lead frame for semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1728562