Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Reexamination Certificate
2007-03-20
2007-03-20
Lam, Cathy F. (Department: 1775)
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
C428S663000, C361S323000, C361S301400, C361S305000, C338S309000, C156S151000, C205S183000
Reexamination Certificate
active
11062751
ABSTRACT:
The invention concerns multilayered constructions useful for forming resistors and capacitors, for the manufacture of printed circuit boards or other microelectronic devices. The multilayered constructions comprise sequentially attached layers comprising: a first electrically conductive layer, a first thermosetting polymer layer, a heat resistant film layer, a second thermosetting polymer layer, and a nickel-phosphorus electrical resistance material layer electroplated onto a second electrically conductive layer.
REFERENCES:
patent: 3808576 (1974-04-01), Castonguay et al.
patent: 4808967 (1989-02-01), Rice et al.
patent: 4888574 (1989-12-01), Rice et al.
patent: 4892776 (1990-01-01), Rice
patent: 5155655 (1992-10-01), Howard et al.
patent: 5336391 (1994-08-01), Rice
patent: 5689227 (1997-11-01), Nguyen et al.
patent: 6356455 (2002-03-01), Carpenter
patent: 6657849 (2003-12-01), Andresakis et al.
patent: 6693793 (2004-02-01), Kuwako et al.
Andresakis John A.
Brandler Daniel
Mahler Bruce
Pramanik Pranabes K.
Lam Cathy F.
Oak-Mitsui Inc.
Ohmega Technologies Inc.
Roberts & Roberts, LLP
LandOfFree
Multilayered construction for resistor and capacitor formation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multilayered construction for resistor and capacitor formation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multilayered construction for resistor and capacitor formation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3805332