Multilayered anisotropic conductive adhesive for fine pitch

Details Multilayered anisotropic conductive adhesive for fine pitch Multilayered anisotropic conductive adhesive for fine pitch

2006-07-25

2006-07-25

Prenty, Mark V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S783000, C428S001500, C349S122000

Reexamination Certificate

active

07081675

ABSTRACT:
Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of ½– 3/2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of ½ or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.

REFERENCES:
patent: 6238597 (2001-05-01), Yim et al.
patent: 6362090 (2002-03-01), Paik et al.
patent: 6518097 (2003-02-01), Yim et al.
patent: 6878435 (2005-04-01), Paik et al.
patent: 2003/0008133 (2003-01-01), Paik et al.
patent: 2006/0033213 (2006-02-01), Yim et al.
patent: 2006/0035036 (2006-02-01), Yim et al.

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