4. Compositions
  5. Electrically conductive or emissive compositions
  6. Free metal containing

Myung Jin Yim

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Method for fabricating wafer-level flip chip package using...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Method for forming flip chip bump and UBM for high speed...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Multilayered anisotropic conductive adhesive for fine pitch

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Preparation method of anisotropic conductive adhesive for...

Compositions – Electrically conductive or emissive compositions – Free metal containing
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Profile ID: LFUS-PAI-P-2037134

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